Effects of High-Temperature Storage on the Elasticity Modulus of an Epoxy Molding Compound.
Changes in the elasticity modulus of an epoxy molding compound (EMC), an electronic packaging polymer, under high-temperature air storage conditions, are discussed in this study. The elasticity modulus of EMC had two different compositions (different filling contents) under different temperatures (175, 200, and 225 °C) and aging times (100, 500, and 1500 h), which were analyzed by using dynamic mechanic analysis technology. The results revealed that the elasticity modulus increased in the thermal aging process, with an increase in the temperature and the aging time. The increments of the glassy and rubbery states were similar. However, the growing rate was significantly different, and the growth of the rubbery state was significantly higher than that of the glassy state. The filling content influenced the degree of aging of the materials significantly. At a low filling content, long-term aging under high temperatures completely changed the material structure, and the mechanical properties of the polymer were reduced.
['Li|Ruifeng|R|', 'Yang|Daoguo|D|', 'Zhang|Ping|P|0000-0001-8639-6605', 'Niu|Fanfan|F|', 'Cai|Miao|M|0000-0001-5836-0998', 'Zhang|Guoqi|G|']
high-temperature storage elasticity modulus epoxy molding compound microelectronics reliability